ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging?

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Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics, and Chet Lennox, of KLA.

Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth. You’ll learn about the limitations of current photonics technology in data centers and proposes a new generation of integrated photonics and silicon to overcome these limitations. You’ll also learn about the development of unique laser technologies for energy efficiency and the latest advancements in optical communication technologies, including full-wafer fabrication and wafer-scale probe technology.

Learn more about Xscape Photonics.

Chet Lenox talks about the growing importance of metrology and inspection in advanced packaging processes. He shares highlights of an ECTC special session, such as the importance of including process control in the Heterogeneous Integration Roadmap, and a technology track on metrology and inspection in future ECTC programs.

You’ll learn why In-line metrology is crucial for controlling processes, ensuring defect-free surfaces, and reducing variability. Quality and yield are key concerns, and more inspection and metrology are needed in the early stages of R&D to ensure success.

Contact Our Speakers on Linkedin:

· Keren Bergman, Ph.D, Professor at Columbia University

· Chet Lenox, Fellow, KLA

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פרקים

1. ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging? (00:00:00)

2. [Ad] The Brandon T. Adams Audio Experience (00:15:22)

3. (Cont.) ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging? (00:16:15)